The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
Dec. 15, 2021
3m Innovative Properties Company, St. Paul, MN (US);
Martin B. Wolk, Woodbury, MN (US);
Robert L. Brott, Woodbury, MN (US);
Kevin W. Gotrik, Hudson, WI (US);
Christopher S. Lyons, St. Paul, MN (US);
Caleb T. Nelson, McKinney, TX (US);
Vadim Savvateev, St. Paul, MN (US);
James M. Nelson, Lino Lakes, MN (US);
Craig R. Schardt, Woodbury, MN (US);
Jeffrey L. Solomon, Centerville, MN (US);
Karl K. Stensvad, Eagan, MN (US);
Steven D. Theiss, Woodbury, MN (US);
3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US);
Abstract
A structured film for forming a pattern on a substrate includes a polymeric support layer, an adhesive layer, an etch resist layer disposed between the polymeric support layer and the adhesive layer, a structured resin layer disposed between the polymeric support layer and the etch resist layer, and one or more unstructured layers disposed between the etch resist layer and the adhesive layer. The structured resin layer has a structured major surface including a plurality of engineered structures. The etch resist layer at least partially fills spaces between adjacent engineered structures to substantially planarize the structured major surface. Methods of using the structured film to form a pattern on a substrate are described.