The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

Jul. 18, 2023
Applicant:

Te Connectivity Solutions Gmbh, Schaffhausen, CH;

Inventors:

Jessica H. B. Hemond, Middletown, PA (US);

Michael Pedrick, Hampton, VA (US);

Rakshith Badarinath, Middletown, PA (US);

Assignee:

TE CONNECTIVITY SOLUTIONS GmbH, Schaffhausen, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 29/22 (2006.01); G01N 29/02 (2006.01); G01N 29/24 (2006.01);
U.S. Cl.
CPC ...
G01N 29/222 (2013.01); G01N 29/02 (2013.01); G01N 29/24 (2013.01);
Abstract

A housing of an ultrasonic sensor includes a plurality of layers of a housing material integrally connected together to form the housing. A first section of the housing has a first plurality of layers of the housing material each with a first thickness. A second section of the housing has a second plurality of layers of the housing material each with a second thickness. The second thickness is greater than the first thickness and an ultrasonic wave transmitted through the housing has a greater transmission efficiency in the first section than in the second section.


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