The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

May. 03, 2024
Applicant:

Uchicago Argonne, Llc, Chicago, IL (US);

Inventors:

Muchuan Hua, Naperville, IL (US);

Wei-Ying Chen, Naperville, IL (US);

Hanyu Hou, Downers Grove, IL (US);

Thomas Gage, Bolingbrook, IL (US);

Benjamin Diroll, Chicago, IL (US);

Haihua Liu, Naperville, IL (US);

Jianguo Wen, Bolingbrook, IL (US);

Jian-Min Zuo, Urbana, IL (US);

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01J 1/58 (2006.01); C23C 14/04 (2006.01); C23C 14/06 (2006.01); C23C 14/48 (2006.01); G01J 1/04 (2006.01); G01J 1/44 (2006.01); G01J 3/02 (2006.01); G01J 3/44 (2006.01);
U.S. Cl.
CPC ...
G01J 1/58 (2013.01); C23C 14/042 (2013.01); C23C 14/0605 (2013.01); C23C 14/48 (2013.01); G01J 1/0411 (2013.01); G01J 1/44 (2013.01); G01J 3/021 (2013.01); G01J 1/0425 (2013.01); G01J 2001/442 (2013.01); G01J 3/44 (2013.01);
Abstract

A method and devices for fabricating optical emitters. The method includes disposing a flake of a multi-layer material onto a wafer. The wafer has an aperture over which a portion of the flake is disposed. The flake has a first surface partially in contact with the wafer, and a second surface opposite the first surface. The method further includes disposing a deceleration mask layer adjacent the flake. The deceleration mask layer has a flake-side surface adjacent to the flake, and an exposed surface opposite the flake-side surface. An ion beam is directed at the exposed surface of the deceleration mask layer to decelerate ions of the ion beam until at least a portion of the ions are implanted in the flake.


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