The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

May. 12, 2022
Applicant:

Bead Origin Inc., Gyeonggi-do, KR;

Inventors:

Taesung Kim, Seoul, KR;

Donggeon Kwak, Gyeonggi-do, KR;

Junho Yun, Gyeonggi-do, KR;

Jae-Do Nam, Seoul, KR;

Na Yeon Kim, Seoul, KR;

Assignee:

BEAD ORIGIN INC., Gyeonggi-do, KR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); C01F 17/235 (2020.01); C09K 3/14 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); C01F 17/235 (2020.01); C09K 3/1409 (2013.01); C01P 2004/50 (2013.01); C01P 2004/64 (2013.01); C01P 2006/22 (2013.01); C01P 2006/40 (2013.01);
Abstract

Inorganic particles comprised in an aqueous dispersion according to the present invention consist of agglomerates of crystalline and amorphous microparticles, and exhibit spherical and smooth surfaces. The spherical appearance, low crystallinity, and narrow particle size distribution of the inorganic particles are further advantageous in reducing scratch defects in a CMP process. In addition, since the microparticles on the inorganic particle surfaces provide more active sites and thus the removal rate is high, the inorganic particles may be advantageous as next-generation CMP polishing materials. In addition, the aqueous dispersion according to the present invention further comprises an amino acid, and the amino acid may be adsorbed on a surface of a silicon oxide wafer to strengthen electrostatic attraction between the silicon oxide wafer and the inorganic particles, resulting in an effect of further improving the removal rate.


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