The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
Aug. 24, 2021
Applicant:
National Research Council of Canada, Ottawa, CA;
Inventors:
Chantal Paquet, Ottawa, CA;
Silvio Elton Krüger, Brossard, CA;
Thomas Lacelle, Ottawa, CA;
Derek Aranguren Van Egmond, Ottawa, CA;
Claudie Roy, Montreal, CA;
Assignee:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09D 5/24 (2006.01); B28B 1/00 (2006.01); B29C 64/106 (2017.01); B33Y 70/10 (2020.01); C09D 5/02 (2006.01); C09D 7/20 (2018.01); C09D 7/40 (2018.01); C09D 7/61 (2018.01); C09D 139/06 (2006.01); C09D 171/02 (2006.01); H10N 30/853 (2023.01); B33Y 10/00 (2015.01); C08K 3/22 (2006.01);
U.S. Cl.
CPC ...
C09D 5/24 (2013.01); B33Y 70/10 (2020.01); C09D 5/02 (2013.01); C09D 7/20 (2018.01); C09D 7/61 (2018.01); C09D 7/68 (2018.01); C09D 139/06 (2013.01); C09D 171/02 (2013.01); H10N 30/8536 (2023.02); H10N 30/8542 (2023.02); H10N 30/8554 (2023.02); H10N 30/8561 (2023.02); B28B 1/001 (2013.01); B33Y 10/00 (2014.12); C08K 2003/2237 (2013.01); C08K 2003/2244 (2013.01); C08K 2201/001 (2013.01);
Abstract
The present disclosure is directed towards a formulation for piezoelectric materials. The formulation may be printed including 2D or 3D printing. The formulation contains ceramic particles, a sol-gel, a high boiling point solvent and a binder.