The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
Nov. 01, 2024
Nippon Electric Glass Co., Ltd., Shiga, JP;
Toru Shiragami, Shiga, JP;
NIPPON ELECTRIC GLASS CO., LTD., Shiga, JP;
Abstract
A method of manufacturing a bonded body includes: a preparation step of interposing a sealing material () containing glass between a highly thermal conductive substrate () and a glass substrate (); and a bonding step of forming a sealing layer () by irradiating the sealing material () with laser light (L). The bonding step includes: a first heating step of preheating the sealing material () at a temperature lower than a softening point of the sealing material () or a temperature at which the sealing material () is prevented from softening and flowing by irradiation with the laser light (L); and a second heating step of heating, after the second heating step, the sealing material () at a temperature equal to or higher than the softening point of the sealing material () or a temperature at which the sealing material () softens and flows by irradiation with the laser light (L).
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile