The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
Feb. 16, 2024
Rohm Co., Ltd., Kyoto, JP;
Yasuyuki Aritaki, Kyoto, JP;
Toshio Watanabe, Kyoto, JP;
Kazuya Nakakubo, Kyoto, JP;
Takamichi Otani, Kyoto, JP;
ROHM CO., LTD., Kyoto, JP;
Abstract
The present disclosure provides a thermal print head. The thermal print head includes: a substrate; a glaze layer, disposed on the substrate; and a wiring layer, disposed on the glaze layer. The wiring layer includes a plurality of bonding pads. The plurality of bonding pads are divided into a plurality of groups. Each of the plurality of groups includes a first bonding pad, a second bonding pad, a third bonding pad and a fourth bonding pad. A first group of the plurality of groups is adjacent to a second group of the plurality of groups along a first direction. The second bonding pad of the first group is located between a center of the first bonding pad of the first group and a center of the third bonding pad of the first group along the first direction.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile