The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
Sep. 10, 2021
Applicant:
Toyo Seikan Group Holdings, Ltd., Tokyo, JP;
Inventors:
Kenya Majima, Yokohama, JP;
Seishi Yoshikawa, Yokohama, JP;
Koki Shibata, Yokohama, JP;
Atsushi Ebata, Yokohama, JP;
Assignee:
TOYO SEIKAN GROUP HOLDINGS, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/08 (2006.01); B32B 7/12 (2006.01); B32B 27/32 (2006.01);
U.S. Cl.
CPC ...
B32B 27/08 (2013.01); B32B 7/12 (2013.01); B32B 27/32 (2013.01); B32B 2250/03 (2013.01); B32B 2250/24 (2013.01); B32B 2307/31 (2013.01); B32B 2307/51 (2013.01); B32B 2307/54 (2013.01); B32B 2307/558 (2013.01); B32B 2553/00 (2013.01);
Abstract
In a packaging bag () including multilayer films for packaging () including a heat-sealable resin layer () on a surface and formed by bonding two of the heat-sealable resin layers () of the multilayer films for packaging (), oriented crystals are present in a seal portion () formed by bonding the heat-sealable resin layers ().