The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
May. 13, 2022
Applicant:
Nsk Ltd., Tokyo, JP;
Inventors:
Takuya Tsunemasu, Kanagawa, JP;
Tomoaki Matsumoto, Kanagawa, JP;
Assignee:
NSK LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29B 11/16 (2006.01); B29B 13/06 (2006.01); B29C 43/00 (2006.01); B29C 43/18 (2006.01); B29C 70/12 (2006.01); B29C 70/46 (2006.01); B29C 70/68 (2006.01); F16C 43/06 (2006.01); B29K 101/10 (2006.01); B29K 105/00 (2006.01); B29L 15/00 (2006.01); B29L 31/04 (2006.01);
U.S. Cl.
CPC ...
B29C 70/68 (2013.01); B29B 11/16 (2013.01); B29B 13/06 (2013.01); B29C 43/003 (2013.01); B29C 43/18 (2013.01); B29C 70/12 (2013.01); B29C 70/46 (2013.01); F16C 43/065 (2013.01); B29K 2101/10 (2013.01); B29K 2105/251 (2013.01); B29L 2015/00 (2013.01); B29L 2031/04 (2013.01);
Abstract
A method for producing a composite material molded article includes a process of, from a solution in which reinforcing fibers with an average fiber length of 0.5 mm or more and thermosetting resin are dispersed and mixed in a solvent, removing the solvent by paper-making to form a preform, and a process of press molding the obtained preform using a mold set at a temperature equal to or higher than a curing temperature of the thermosetting resin to form the composite material molded article.