The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

Jul. 27, 2020
Applicants:

Heraeus Deutschland Gmbh & Co. KG, Hanau, DE;

Heraeus Medical Components Llc, St. Paul, MN (US);

Inventors:

Joerg-Martin Gebert, Hanau, DE;

Paul Schuster, St. Paul, MN (US);

Yang Yu, Singapore, SG;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/36 (2014.01); B23K 26/352 (2014.01); B23K 26/362 (2014.01); B23K 101/32 (2006.01); B23K 101/34 (2006.01); A61B 5/1486 (2006.01);
U.S. Cl.
CPC ...
B23K 26/36 (2013.01); B23K 26/355 (2018.08); B23K 26/362 (2013.01); A61B 5/14865 (2013.01); B23K 2101/32 (2018.08); B23K 2101/34 (2018.08);
Abstract

One aspect refers to a method for preparing a processed filament, including providing a filament, which comprises a multitude of segments, which follow one another in a longitudinal direction of the filament, wherein each of the segments of the multitude of segments comprises a multitude of sections, which are disposed circumferentially around the filament; and processing the filament in n processing steps, thereby obtaining the processed filament. For each integer i in the range from 1 to n, the iprocessing step comprises, for each integer j in the range from 1 to m, processing the jsection of the (i+j−1)segment. N and m are integers which are, independent from one another, at least 2. Sections of different number are at different circumferential locations of the filament. The processing of each section of each segment of the filament comprises an interaction of the section of the segment of the filament with at least one processing beam.


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