The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
Aug. 26, 2021
Applicant:
National University Corporation Hokkaido University, Sapporo, JP;
Inventor:
Tetsu Yonezawa, Sapporo, JP;
Assignee:
National University Corporation Hokkaido University, Sapporo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/102 (2022.01); B22F 7/04 (2006.01); B22F 9/04 (2006.01); B22F 9/10 (2006.01);
U.S. Cl.
CPC ...
B22F 1/102 (2022.01); B22F 7/04 (2013.01); B22F 9/04 (2013.01); B22F 2009/043 (2013.01); B22F 9/10 (2013.01); B22F 2301/10 (2013.01); B22F 2302/25 (2013.01); B22F 2302/45 (2013.01);
Abstract
Disclosed is oxide-containing copper fine particles including CuO and optionally CuO and coated with a carboxylic acid, wherein a mass ratio of CuO to a total mass of Cu, CuO and CuO is 0.5 to 2.0% by mass.
Yonezawa, Tetsu. (2026). Oxide-containing copper fine particles, method for producing same, and method for producing sintered compact using oxide-containing copper fine particles (U.S. Patent No. 12623281). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12623281
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile