The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

Sep. 28, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jae Hong Lee, Suwon-si, KR;

Kak Namkoong, Seoul, KR;

Hyeong Seok Jang, Seoul, KR;

Won Jong Jung, Suwon-si, KR;

Hyung Jun Youn, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01); B01L 7/00 (2006.01);
U.S. Cl.
CPC ...
B01L 3/5027 (2013.01); B01L 7/52 (2013.01); B01L 2200/10 (2013.01); B01L 2200/147 (2013.01); B01L 2300/0819 (2013.01); B01L 2300/1816 (2013.01);
Abstract

A gene amplification chip may include: a cover layer having a solution inlet through which a sample solution to be injected; a chamber layer disposed on one surface of the cover layer, and having a chamber to receive the sample solution when the sample solution is injected through the solution inlet such that an amplification reaction of the sample solution occurs in the chamber; a bottom layer disposed on another surface of the chamber layer; and a photothermal film attached to an outer surface of the bottom layer, and configured to convert light into heat to heat the sample solution received in the chamber.


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