The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

Aug. 12, 2020
Applicant:

Nike, Inc., Beaverton, OR (US);

Inventors:

Cody Evin Janes, Beaverton, OR (US);

Daniel P. Morgan, Beaverton, OR (US);

Kyle Schepke, Portland, OR (US);

Joshua Patrick Williams, Portland, OR (US);

Yang-Hua Ou, Miaoli, TW;

Assignee:

NIKE, Inc., Beaverton, OR (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A41D 27/28 (2006.01); A41D 13/015 (2006.01); A41D 31/02 (2019.01); A41D 31/12 (2019.01); A41D 31/18 (2019.01); B05C 5/02 (2006.01); B05C 11/00 (2006.01); B05D 1/26 (2006.01); B05D 1/28 (2006.01); B05D 7/14 (2006.01); B32B 3/08 (2006.01); B32B 3/26 (2006.01); B32B 5/26 (2006.01); B32B 7/05 (2019.01); B32B 37/00 (2006.01); D06B 1/02 (2006.01);
U.S. Cl.
CPC ...
A41D 27/28 (2013.01); A41D 13/0156 (2013.01); A41D 31/02 (2013.01); A41D 31/125 (2019.02); A41D 31/185 (2019.02); B05C 5/0208 (2013.01); B05C 11/00 (2013.01); B05D 1/265 (2013.01); B05D 1/286 (2013.01); B05D 7/14 (2013.01); B32B 3/085 (2013.01); B32B 5/26 (2013.01); B32B 7/05 (2019.01); B32B 37/0076 (2013.01); D06B 1/02 (2013.01); B32B 3/266 (2013.01); B32B 2274/00 (2013.01); B32B 2305/18 (2013.01); B32B 2307/728 (2013.01); B32B 2307/734 (2013.01); Y10T 442/162 (2015.04); Y10T 442/3854 (2015.04); Y10T 442/40 (2015.04);
Abstract

Aspects herein are directed to systems, methods, and articles for producing a patterned film and using the patterned film to form a pattern of discrete overlay film structures on a substrate material. A uniform thickness of a film material is deposited on to a first surface of a run of carrier sheets, where each carrier sheet includes one or more holes extending there through. A first carrier sheet is extracted from the run of carrier sheets, and a second surface of the carrier sheet is positioned on a substrate material. Heat and/or pressure is applied to the film material to cause the film material to transfer to the substrate material through the one or more holes in the carrier sheet forming a pattern of discrete overlay film structures on the substrate material. The carrier sheet along with remaining portions of the film material is removed from the substrate material.


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