The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2026
Filed:
Jun. 29, 2023
Mediatek Inc., Hsin-Chu, TW;
Wei-Chih Chen, Hsinchu, TW;
Shi-Bai Chen, Hsinchu, TW;
MEDIATEK INC., Hsinchu, TW;
Abstract
A semiconductor package includes a partitioned package substrate that is composed of multiple discrete substrates arranged in a side-by-side manner. The discrete substrates include a central substrate and peripheral substrates surrounding the central substrate. At least one integrated circuit die is mounted on a first surface of the partitioned package substrate. A plurality of solder balls is mounted on a second surface of the partitioned package substrate opposite to the first surface.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile