The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2026

Filed:

Sep. 22, 2023
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Yoshihito Otsubo, Nagaokakyo, JP;

Hirofumi Oie, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/65 (2026.01); H10W 42/20 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01); H03H 9/46 (2006.01); H10W 70/60 (2026.01); H10W 70/652 (2026.01);
U.S. Cl.
CPC ...
H10W 70/65 (2026.01); H10W 42/20 (2026.01); H10W 74/114 (2026.01); H10W 90/00 (2026.01); H03H 9/46 (2013.01); H10W 70/60 (2026.01); H10W 70/6523 (2026.01); H10W 90/724 (2026.01);
Abstract

An electronic circuit module includes a substrate, a first electronic component mounted on one principal surface of the substrate, a substrate electrode provided on the one principal surface, a second electronic component supported by a support surface opposite to a surface of the first electronic component facing the one principal surface, a component electrode provided on a surface of the second electronic component, and a conductor including a connection part connecting the substrate electrode and the component electrode. The second electronic component includes a conductive portion electrically connected to the component electrode. The conductive portion is separated from a support surface of the first electronic component.


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