The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2026
Filed:
Sep. 29, 2023
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Takashi Yamada, Nagaokakyo, JP;
Kiyoshi Aikawa, Nagaokakyo, JP;
Hiromichi Kitajima, Nagaokakyo, JP;
Takanori Uejima, Nagaokakyo, JP;
Yoshihiro Daimon, Nagaokakyo, JP;
MURATA MANUFACTURING CO., LTD., Nagaokakyo, JP;
Abstract
A high-frequency module includes a first module substrate including first and second major surfaces, and a second module substrate including third and fourth major surfaces. The first major surface (faces the second major surface. Electronic components are disposed between the second and third major surfaces, on the first major surface, and on the fourth major surface. External connection terminals are disposed on the fourth major surface. A recess is formed in the first major surface. The electronic components include a first electronic component and a second electronic component (shorter in height than the first electronic component. The first electronic component is disposed in the recess, and the second electronic component is disposed in a region outside of the recess on the first major surface.