Semiconductor package

Abstract

A device which enables protection against an abruptly rising pulse such as an electromagnetic pulse in a compact size at a device level and a semiconductor package in which the device is mounted are provided. The semiconductor package () includes a substrate (), an IC chip () arranged on the substrate (), a plurality of connection parts () configured to connect the IC chip () to the outside, a plurality of bonding wires () configured to connect the IC chip () and corresponding ones of the plurality of connection parts (), and a mechanism configured to bypass surge current applied to any of the plurality of connection parts () from the connection parts () to a ground potential via a path different from the plurality of bonding wires ().