The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2026
Filed:
Oct. 28, 2021
Applicant:
Samsung Display Co., Ltd., Yongin-si, KR;
Inventors:
Jieun Ko, Suwon-si, KR;
Yohan Kim, Seoul, KR;
Yisu Kim, Seoul, KR;
Wonmin Yun, Yongin-si, KR;
Byoungduk Lee, Seongnam-si, KR;
Seungju Lee, Suwon-si, KR;
Jaehyuk Lee, Seoul, KR;
Hyungdong Lee, Hwaseong-si, KR;
Yoonhyeung Cho, Yongin-si, KR;
Hyeonseo Cho, Asan-si, KR;
Assignee:
Samsung Display Co., Ltd., Yongin-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10K 59/80 (2023.01); H10K 59/12 (2023.01); H10K 59/122 (2023.01); H10K 102/00 (2023.01);
U.S. Cl.
CPC ...
H10K 59/8731 (2023.02); H10K 59/874 (2023.02); H10K 59/12 (2023.02); H10K 59/122 (2023.02); H10K 2102/331 (2023.02); H10K 2102/351 (2023.02);
Abstract
An encapsulation structure includes an organic encapsulation layer. The organic encapsulation layer includes a base resin and hygroscopic composite particles including a hygroscopic composite particle. The hygroscopic composite particle includes a core and a silica layer around the core. The core includes a polymer. The silica layer includes silica.