The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2026

Filed:

Dec. 27, 2022
Applicant:

Huawei Technologies Co., Ltd., Shenzhen, CN;

Inventor:

Tsuyoshi Ogawa, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/857 (2025.01); H10H 20/833 (2025.01); H10H 20/84 (2025.01); H10H 20/01 (2025.01);
U.S. Cl.
CPC ...
H10H 20/857 (2025.01); H10H 20/833 (2025.01); H10H 20/84 (2025.01); H10H 20/0364 (2025.01);
Abstract

The present disclosure provides devices and method of manufacturing the devices. An example device includes a substrate, a first electrode on the substrate, a light-emitting element electrically connected to the first electrode by a first metal wiring, and a second electrode electrically connected to the light-emitting element. The first electrode and the light-emitting element are laterally separated from each other. The light-emitting element is connected to the first metal wiring at a side that faces the substrate.


Find Patent Forward Citations

Ogawa, Tsuyoshi. (2026). Device and a method for manufacturing the same (U.S. Patent No. 12622116). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12622116

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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