The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2026

Filed:

Jun. 26, 2020
Applicant:

Chemelex Europe Gmbh, Schaffhausen, CH;

Inventors:

Jennifer Robison, San Carlos, CA (US);

Wade Depolo, Sunnyvale, CA (US);

Sirarpi B. Jenkins, Menlo Park, CA (US);

Linda D.B. Kiss, San Mateo, CA (US);

Marcus Kleinehanding, Tolochenaz, CH;

Paul Becker, San Carlos, CA (US);

Assignee:

Chemelex Europe GmbH, Schaffhausen, CH;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05B 3/56 (2006.01); B29C 48/00 (2019.01); B29C 48/06 (2019.01); B29C 48/154 (2019.01); B29K 105/16 (2006.01); B29L 31/34 (2006.01); H05B 3/18 (2006.01);
U.S. Cl.
CPC ...
H05B 3/56 (2013.01); B29C 48/022 (2019.02); B29C 48/06 (2019.02); B29C 48/154 (2019.02); H05B 3/18 (2013.01); B29K 2105/16 (2013.01); B29L 2031/3462 (2013.01); H05B 2203/007 (2013.01); H05B 2203/01 (2013.01); H05B 2203/017 (2013.01); H05B 2203/02 (2013.01);
Abstract

Embodiments of the invention provide self-regulating heater cables utilizing substantially solid polymeric buffer layers surrounding the heating elements having improved heat transfer efficiency as well as improved reliability and endurance. The assembly includes first and second power supply wires configured to carry electrical power and separated by a solid spacer, a substantially solid electrically-insulating buffer layer in thermal contact with the heating element, and a cable jacket including a polymeric outer surface and an inner metallic sheath surrounding the buffer layer and in thermal contact with the buffer layer. The buffer layer includes a polymeric material having a thermal conductivity greater than air at standard temperature and pressure and surrounds the heating element, power supply wires, and spacer.


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