The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2026
Filed:
Apr. 25, 2022
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Akihiro Murata, Hokuto, JP;
Assignee:
SEIKO EPSON CORPORATION, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/10 (2006.01); H03B 5/32 (2006.01); H03H 3/02 (2006.01); H03H 9/05 (2006.01); H03H 9/19 (2006.01);
U.S. Cl.
CPC ...
H03H 9/1021 (2013.01); H03B 5/32 (2013.01); H03H 3/02 (2013.01); H03H 9/0557 (2013.01); H03H 9/19 (2013.01); H03H 2003/022 (2013.01);
Abstract
A vibration device includes a vibration element; a package including a base that is a semiconductor substrate having a first surface and a second surface that are in front-back relation, with the vibration element disposed at the first surface, an oscillation circuit that is disposed at the base and electrically coupled to the vibration element, and a lid that is a semiconductor substrate bonded to the base so as to accommodate the vibration element and electrically coupled to the base, and a resin layer disposed at the outer surface of the package.