The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2026

Filed:

Feb. 24, 2021
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Junya Suzuki, Tokyo, JP;

Hideya Nishikawa, Tokyo, JP;

Yoshihiko Onishi, Tokyo, JP;

Isao Sonoda, Tokyo, JP;

Takayuki Nakao, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02K 5/22 (2006.01); H01R 12/58 (2011.01); H01R 43/20 (2006.01); H02K 11/33 (2016.01); H02K 15/32 (2025.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H02K 5/225 (2013.01); H01R 12/585 (2013.01); H01R 43/205 (2013.01); H02K 11/33 (2016.01); H02K 15/32 (2025.01); H05K 7/209 (2013.01); H02K 2211/03 (2013.01);
Abstract

A circuit connection apparatus has a connector including a housing in which a connection terminal is contained, a positioning guide portion provided therein at an opposite side to an opening portion of the housing, and a press-fit terminal extended from the connection terminal. Moreover, the circuit connection apparatus has a heat sink that includes a guide receipt portion fitted with the positioning guide portion—and an opening to be penetrated by the press-fit terminal and to which the housing is fixed. Furthermore, the circuit connection apparatus has a circuit board that includes a board positioning guide portion and a through-hole to which the press-fit terminal is pressure-bonded and that is fixed to the heat sink. Because the press-fit terminal and the through-hole can accurately be positioned, it is made possible that the reliability is raised and a simple assembly process suppresses the production cost from rising.


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