The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2026

Filed:

Dec. 16, 2021
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Yuhei Horikawa, Tokyo, JP;

Makoto Endo, Tokyo, JP;

Takuya Kakiuchi, Tokyo, JP;

Miyuki Yanagida, Tokyo, JP;

Yuki Naito, Tokyo, JP;

Takahiro Tashiro, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/66 (2006.01); H01M 4/38 (2006.01); H01M 10/0525 (2010.01); H01M 4/02 (2006.01);
U.S. Cl.
CPC ...
H01M 4/667 (2013.01); H01M 4/386 (2013.01); H01M 4/661 (2013.01); H01M 10/0525 (2013.01); H01M 2004/027 (2013.01);
Abstract

A laminated body contains a first metal layer containing copper; and a second metal layer containing nickel and laminated directly on the first metal layer. A first surface of the second metal layer is a surface in contact with the first metal layer. A second surface of the second metal layer is a reverse face of the first surface. A thickness direction of the second metal layer is a direction approximately perpendicular to the first surface and oriented from the first surface toward the second surface. A unit of a content of nickel in the second metal layer is % by mass. The content of nickel in the second metal layer 2 decreases along the thickness direction D.


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