The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2026

Filed:

Mar. 07, 2022
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Yuya Ishima, Tokyo, JP;

Kosuke Ito, Tokyo, JP;

Shinichi Kondo, Tokyo, JP;

Shingo Hattori, Tokyo, JP;

Hidenobu Umeda, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 41/04 (2006.01); H01F 27/29 (2006.01); H01F 27/32 (2006.01);
U.S. Cl.
CPC ...
H01F 41/046 (2013.01); H01F 27/292 (2013.01); H01F 27/327 (2013.01); H01F 41/041 (2013.01);
Abstract

A method for manufacturing a multilayer coil componentincludes: a step of forming a conductor by a photolithography method using photosensitive conductive paste; a step of forming an insulating film covering the conductor by a photolithography method using photosensitive insulating paste; a step of forming a resin layer holding the conductor covered with the insulating film by a positive-type photoresist; a step of forming a plurality of the conductors and the insulating film and then removing the resin layer by irradiating the resin layer with ultraviolet rays and developing the resin layer; and a step of filling the conductor covered with the insulating film with a magnetic material after removing the resin layer.


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