The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2026

Filed:

Aug. 31, 2022
Applicant:

Taiyo Yuden Co., Ltd., Tokyo, JP;

Inventor:

Hirotaka Takeuchi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 17/00 (2006.01); H01F 17/02 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/40 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0013 (2013.01); H01F 17/02 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/40 (2013.01); H01F 2017/0026 (2013.01);
Abstract

A multilayer electronic component includes a multilayer structure that includes dielectric layers stacked in a stack direction and has first and second surfaces provided on respective sides in the stack direction, a first side-surface electrode provided on a side surface of the multilayer structure, an inductor provided in the multilayer structure, a capacitor provided between the inductor and the first surface, a via wiring line penetrating dielectric layers from a first dielectric layer, which is in contact with the inductor, to a second dielectric layer, which is located closer to the first surface than at least a part of the capacitor, and electrically connecting a first end of the inductor and the first side-surface electrode, and a second side-surface electrode electrically connected to the first side-surface electrode through the inductor and the via wiring line and provided on the side surface or another side surface of the multilayer structure.


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