The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2026
Filed:
Jan. 13, 2025
Yupo Corporation, Tokyo, JP;
Takuya Ikarashi, Ibaraki, JP;
YUPO CORPORATION, Tokyo, JP;
Abstract
Provided is a labeled molded body which enables a label and an RFID member to be easily separated from a molded body and to be each recycled and whose production process is simple. A labeled molded body includes a molded body and a label disposed on a surface of the molded body, and further having an RFID member disposed between the molded body and the label, wherein the molded body includes a thermoplastic resin at least in a surface layer, the label has a substrate layer including a thermoplastic resin, adhesive strength between the molded body and the RFID member (P) is 100 gf/15 mm or less and is equal to or less than adhesive strength between the RFID member and the label (P), and adhesive strength between the molded body and the label (P) is 90 to 300 gf/15 mm.