The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2026

Filed:

Jun. 30, 2022
Applicant:

Dongjin Semichem Co., Ltd., Incheon, KR;

Inventors:

Hyoc Min Youn, Hwaseong-si, KR;

Tai Hoon Yeo, Hwaseong-si, KR;

Gi Seon Lee, Hwaseong-si, KR;

Bong Hee Kim, Hwaseong-si, KR;

Dong Myung Kim, Hwaseong-si, KR;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F 7/023 (2006.01); G03F 7/037 (2006.01); G03F 7/039 (2006.01); H10K 59/124 (2023.01);
U.S. Cl.
CPC ...
G03F 7/0233 (2013.01); G03F 7/037 (2013.01); G03F 7/039 (2013.01); H10K 59/124 (2023.02);
Abstract

A positive photosensitive resin composition includes a polymer resin, a quinonediazide compound, and a solvent. The polymer resin includes (i) 5 to 95 wt. % of a polyimide precursor having a structural unit represented by Formula 1, ii) 5 to 95 wt. % of a polyimide precursor having a structural unit represented by Formula 2, and iii) 0 to 20 wt. % of a polyimide precursor having a structural unit represented by Formula 3. The quinonediazide compound is included in an amount of 5 to 50 parts by weight per 100 parts by weight of the polymer resin. The solvent is included in an amount of 100 to 2,000 parts by weight per 100 parts by weight of the polymer resin.


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Youn, Hyoc. (2026). Positive photosensitive resin composition (U.S. Patent No. 12619144). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12619144

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