The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2026
Filed:
Jan. 03, 2023
Meta Platforms Technologies, Llc, Menlo Park, CA (US);
Sheng Ye, Redmond, WA (US);
Jing Chen, Redmond, WA (US);
Hao Mei, Redmond, WA (US);
Andrew John Ouderkirk, Kirkland, WA (US);
Arman Boromand, Issaquah, WA (US);
Kristy Alana Jost, Redmond, WA (US);
Nagi Hosni Elabbasi, Southborough, MA (US);
Jonathan Robert Peterson, Woodinville, WA (US);
Christopher Yuan Ting Liao, Seattle, WA (US);
Meta Platforms Technologies, LLC, Menlo Park, CA (US);
Abstract
Mechanically and piezoelectrically anisotropic polymer fibers may be formed by spinning a polymer solution or gel that includes a high molecular weight crystallizable polymer and a liquid solvent. The solvent may be configured to interact with the polymer to facilitate chain alignment and, in some examples, create a higher crystalline content within the spun fibers. The polymer solution may also include a low molecular weight additive. The high and low molecular weight polymers may each be characterized by a bimodal molecular weight distribution where the molecular weight of the additive is less than the molecular weight of the crystallizable polymer. The polymer(s) and the additive(s) may be independently selected from vinylidene fluoride, trifluoroethylene, chlorotrifluoroethylene, hexafluoropropene, vinyl fluoride, etc. The spun fibers may be oriented, annealed, poled, and woven or laminated to form a polymer thin film having a high elastic modulus and a high electromechanical coupling factor.