The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2026
Filed:
Dec. 15, 2022
Honeywell Federal Manufacturing & Technologies, Llc, Kansas City, MO (US);
Christian Gentry Miles Barr, Kansas City, MO (US);
Timothy Prost, Fremont, CA (US);
Honeywell Federal Manufacturing & Technologies, LLC, Kansas City, MO (US);
Iowa State University Research Foundation, Inc., Ames, IA (US);
Abstract
A micro-alloyed copper powder was produced using gas atomization reaction synthesis, with the alloy preferably comprising Cu-0.3Zr-0.15Ag wt. %. The novel copper alloy improves the manufacturability of copper in powder bed fusion manufacturing processes by minimizing or avoiding the prior art problems associated with oxidation of the copper precursor used in additive manufacturing. Advantageously, the provided copper alloy powder maintains the high electrical conductivity of copper while addressing the prior art oxidation issue.