The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2026
Filed:
Apr. 29, 2024
Applicant:
Ajinomoto Co., Inc., Tokyo, JP;
Inventor:
Kenji Kawai, Kawasaki, JP;
Assignee:
AJINOMOTO CO., INC., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/00 (2006.01); B32B 5/02 (2006.01); B32B 15/09 (2006.01); B32B 27/12 (2006.01); B32B 27/36 (2006.01); C08L 63/00 (2006.01); C09J 7/25 (2018.01); C09J 7/29 (2018.01); C09J 7/35 (2018.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); B32B 5/02 (2013.01); B32B 15/09 (2013.01); B32B 27/12 (2013.01); B32B 27/36 (2013.01); C08L 63/00 (2013.01); C09J 7/255 (2018.01); C09J 7/29 (2018.01); C09J 7/35 (2018.01); H05K 1/0326 (2013.01); H05K 1/0366 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2307/206 (2013.01); B32B 2457/08 (2013.01); C08L 2203/20 (2013.01); C09J 2400/163 (2013.01); C09J 2463/00 (2013.01); C09J 2467/006 (2013.01);
Abstract
Resin compositions including: (A) a naphthol aralkyl type epoxy resin having a weight-average molecular weight (Mw) of 1,000 or more and an epoxy equivalent of 350 g/eq. or more; and (B) a curing agent, in which (B) the curing agent includes an active ester type curing agent are useful for preparing cured products, sheet lamination materials, resin sheets, printed wiring boards, and semiconductor devices, and for methods for producing printed wiring boards or semiconductor devices.
Quick Actions:
Kawai, Kenji. (2026). Resin composition, cured product, sheet-like laminate material, resin sheet, printed wiring board, and semiconductor device (U.S. Patent No. 12617986). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12617986
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile