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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12617981 B1

PDFFull Text
Date of Patent:
May. 05, 2026

Filed:

Jul. 25, 2023

Pressure-sensitive adhesive sheet for semiconductor processing

Applicant:

Nitto Denko Corporation, Ibaraki, JP;

Inventors:

Jun Akiyama, Ibaraki, JP;

Yuji Kato, Ibaraki, JP;

Taiki Ueno, Ibaraki, JP;

Assignee:

NITTO DENKO CORPORATION, Ibaraki, JP;

Attorney:

Alleman Hall LLP

Primary Examiner:

John D Freeman

Int. Cl.
CPC ...
C09J 7/38 (2018.01); C08F 220/18 (2006.01); C08K 5/524 (2006.01); C09J 11/06 (2006.01); C09J 133/06 (2006.01); H10P 72/70 (2026.01);
U.S. Cl.
CPC ...
C09J 7/385 (2018.01); C08F 220/1808 (2020.02); C08F 220/1812 (2020.02); C09J 11/06 (2013.01); C09J 133/066 (2013.01); H10P 72/7402 (2026.01); C08F 2500/22 (2013.01); C08F 2500/26 (2013.01); C08F 2800/10 (2013.01); C08K 5/524 (2013.01); C09J 2203/326 (2013.01); C09J 2301/302 (2020.08); C09J 2301/312 (2020.08); C09J 2301/408 (2020.08); C09J 2423/006 (2013.01); C09J 2467/006 (2013.01);
Abstract

Provided is a pressure-sensitive adhesive sheet for semiconductor processing having excellent solvent resistance. The pressure-sensitive adhesive sheet for semiconductor processing includes a pressure-sensitive adhesive layer formed of a pressure-sensitive adhesive composition containing a base polymer, and a base material. The pressure-sensitive adhesive composition has a swelling degree Sof 2.1 times or less when immersed in an N,N-dimethylpropionamide solution at 23° C. for 1 hour.

Find Patent Forward Citations

Akiyama, Jun. (2026). Pressure-sensitive adhesive sheet for semiconductor processing (U.S. Patent No. 12617981). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12617981

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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