The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2026
Filed:
Sep. 22, 2021
Sekisui Chemical Co., Ltd., Osaka, JP;
Toshio Takahashi, Osaka, JP;
Tokushige Shichiri, Osaka, JP;
Satoshi Hayashi, Osaka, JP;
Izumi Daido, Osaka, JP;
Fumika Hoshino, Osaka, JP;
SEKISUI CHEMICAL CO., LTD., Osaka, JP;
Abstract
The present invention aims to provide a curable resin composition that can reduce the occurrence of voids and partial detachment between the composition and a support even in high-temperature processing at 300° C. or higher with an adherend fixed to the support with the composition, and is easily separable after the high-temperature processing. The present invention also aims to provide a temporary fixing material including an adhesive layer containing the curable resin composition and a method of producing an electronic component using the temporary fixing material. Provided is a curable resin composition containing: a maleimide group-containing reactive compound (1); and a resin (2) having an imide skeleton in a backbone repeating unit.