The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2026
Filed:
Mar. 05, 2025
Applicant:
Taiwan Union Technology Corporation, Zhubei City, TW;
Inventor:
Tsung-Hsien Lin, Zhubei City, TW;
Assignee:
Taiwan Union Technology Corporation, Zhubei City, TW;
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/16 (2006.01); C08J 5/24 (2006.01); C08L 63/00 (2006.01); C09D 7/40 (2018.01); C09D 7/61 (2018.01); C09D 163/00 (2006.01); H05K 1/03 (2006.01); C08K 3/22 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); B32B 3/16 (2013.01); C08J 5/244 (2021.05); C08J 5/249 (2021.05); C09D 7/61 (2018.01); C09D 7/69 (2018.01); C09D 163/00 (2013.01); H05K 1/0366 (2013.01); C08J 2363/02 (2013.01); C08J 2461/12 (2013.01); C08K 2003/2227 (2013.01); C08K 2201/005 (2013.01);
Abstract
A resin composition is provided. The resin composition comprises (A) an epoxy resin, (B) a dicyclopentadiene-based phenol resin, and (C) a first filler. The first filler is a boehmite filler having a D50 diameter ranging from 1 μm to 4 μm.