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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12617930 B1

PDFFull Text
Date of Patent:
May. 05, 2026

Filed:

May. 09, 2022

Resin composition, molded body using same and method for producing resin composition

Applicant:

Kuraray Co., Ltd., Kurashiki, JP;

Inventors:

Shuichi Sunaga, Kurashiki, JP;

Yuta Matsushita, Kurashiki, JP;

Wenjie Lu, Kurashiki, JP;

Assignee:

KURARAY CO., LTD., Kurashiki, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Sheeba Ahmed

Int. Cl.
CPC ...
C08K 3/38 (2006.01); B32B 1/08 (2006.01); B32B 27/08 (2006.01); B32B 27/10 (2006.01); B32B 27/16 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B65D 65/40 (2006.01); C08J 5/18 (2006.01);
U.S. Cl.
CPC ...
C08K 3/38 (2013.01); B32B 1/08 (2013.01); B32B 27/08 (2013.01); B32B 27/10 (2013.01); B32B 27/16 (2013.01); B32B 27/306 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B65D 65/40 (2013.01); C08J 5/18 (2013.01); B32B 2250/24 (2013.01); B32B 2250/40 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2307/31 (2013.01); B32B 2439/46 (2013.01); B32B 2439/70 (2013.01); B32B 2457/12 (2013.01); B32B 2597/00 (2013.01); C08J 2333/12 (2013.01); C08K 2003/387 (2013.01);
Abstract

A resin composition comprising: a resin (A) having 30 mol % or more of a structural unit represented by a formula (1) below, and a boron compound (B), the boron compound (B) containing a boron element in an amount of 0.01 to 2,000 μmol per gram of the resin (A).

Find Patent Forward Citations

Sunaga, Shuichi. (2026). Resin composition, molded body using same and method for producing resin composition (U.S. Patent No. 12617930). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12617930

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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