The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2026

Filed:

Dec. 16, 2022
Applicant:

Kt&g Corporation, Daejeon, KR;

Inventors:

Kyoung Hwan Oh, Yuseong-gu, KR;

Min Hee Hwang, Yuseong-gu, KR;

Soo Ho Kim, Yuseong-gu, KR;

Man Seok Seo, Yuseong-gu, KR;

Assignee:

KT&G CORPORATION, Daejeon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 65/46 (2006.01); B32B 27/08 (2006.01); B32B 27/30 (2006.01); B32B 27/36 (2006.01); B65D 65/42 (2006.01); C09D 127/08 (2006.01); C09D 167/04 (2006.01);
U.S. Cl.
CPC ...
B65D 65/466 (2013.01); B32B 27/08 (2013.01); B32B 27/304 (2013.01); B32B 27/36 (2013.01); B65D 65/42 (2013.01); C09D 127/08 (2013.01); C09D 167/04 (2013.01); B32B 2250/03 (2013.01); B32B 2250/24 (2013.01); B65D 2565/387 (2013.01);
Abstract

Provided is a biodegradable film for cigarette packaging, the film including a first film layer applied such that one surface thereof faces a cigarette product, a third film layer applied such that one surface thereof is exposed to the outside, and a second film layer positioned between the first film layer and the third film layer. In the biodegradable film, the first film layer, the second film layer and the third film layer are each formed with different compositions, and at least one of the first film layer, the second film layer and the third film layer includes a biodegradable material. The biodegradable film has a biodegradation rate of 90% or more after 60 days, and has a heat shrink ratio of 4.0% or more.


Find Patent Forward Citations

Loading…