The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2026

Filed:

Apr. 22, 2021
Applicant:

Kuraray Co., Ltd., Okayama, JP;

Inventor:

Kentaro Yoshida, Kurashiki, JP;

Assignee:

KURARAY CO., LTD., Okayama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/02 (2019.01); B29C 48/00 (2019.01); B29C 48/08 (2019.01); B29C 48/21 (2019.01); B29C 55/12 (2006.01); B29K 23/00 (2006.01); B29K 77/00 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B65D 65/40 (2006.01); C08J 7/048 (2020.01); C08J 7/06 (2006.01); C08L 29/04 (2006.01); C08L 31/04 (2006.01);
U.S. Cl.
CPC ...
B32B 7/02 (2013.01); B32B 27/08 (2013.01); B32B 27/306 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B65D 65/40 (2013.01); C08J 7/048 (2020.01); C08J 7/06 (2013.01); C08L 29/04 (2013.01); C08L 31/04 (2013.01); B29C 48/0018 (2019.02); B29C 48/08 (2019.02); B29C 48/21 (2019.02); B29C 55/12 (2013.01); B29K 2023/086 (2013.01); B29K 2023/12 (2013.01); B29K 2077/00 (2013.01); B32B 7/12 (2013.01); B32B 2250/24 (2013.01); B32B 2255/10 (2013.01); B32B 2255/20 (2013.01); B32B 2270/00 (2013.01); B32B 2307/414 (2013.01); B32B 2307/518 (2013.01); B32B 2307/7244 (2013.01); B32B 2307/732 (2013.01); B32B 2439/70 (2013.01); C08J 2323/08 (2013.01); C08J 2329/04 (2013.01); C08J 2477/02 (2013.01);
Abstract

There is provided a multilayer structure comprising at least a barrier resin layer (X) and an inorganic barrier layer (Y) with a thickness of 500 nm or less which is adjacent to the barrier resin layer (X), wherein the layer (X) is made of a resin composition (x) comprising an ethylene-vinyl alcohol copolymer (A) and a polyamide (B) in a mass ratio (A/B) of 55/45 to 98/2, and the ethylene-vinyl alcohol copolymer (A) has an ethylene content of 20 to 46 mol % and a saponification degree of 90 mol % or more. Thus, there can be provided a multilayer structure having excellent gas barrier properties and appearance even after being subjected to stretching process or retorting process followed by bending process, and a packaging material for retort therewith.


Find Patent Forward Citations

Yoshida, Kentaro. (2026). Multilayer structure, and packaging material for retort using same (U.S. Patent No. 12617181). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12617181

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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