logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12617159 B1

PDFFull Text
Date of Patent:
May. 05, 2026

Filed:

Jul. 02, 2024

Wire anchoring for co-extruded printing

Applicant:

UT Battelle, Llc, Oak Ridge, TN (US);

Inventors:

Michael C. Borish, Knoxville, TN (US);

Alex C. Roschli, Knoxville, TN (US);

Jesse Heineman, Knoxville, TN (US);

Ahmed A. Hassen, Knoxville, TN (US);

Assignee:

UT-Battelle, LLC, Oak Ridge, TN (US);

Attorney:

Warner Norcross + Judd LLP

Primary Examiner:

Larry W Thrower

Int. Cl.
CPC ...
B29C 64/393 (2017.01); B29C 64/118 (2017.01); B33Y 10/00 (2015.01); B33Y 40/20 (2020.01); B33Y 50/02 (2015.01); B33Y 70/10 (2020.01); B33Y 80/00 (2015.01); B29K 69/00 (2006.01); B29K 105/08 (2006.01); B29K 105/20 (2006.01); B29K 307/04 (2006.01); B29K 309/08 (2006.01); B29K 705/08 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 64/393 (2017.08); B29C 64/118 (2017.08); B33Y 10/00 (2014.12); B33Y 40/20 (2020.01); B33Y 50/02 (2014.12); B33Y 70/10 (2020.01); B33Y 80/00 (2014.12); B29K 2069/00 (2013.01); B29K 2105/08 (2013.01); B29K 2105/20 (2013.01); B29K 2307/04 (2013.01); B29K 2309/08 (2013.01); B29K 2705/08 (2013.01); B29L 2031/757 (2013.01);
Abstract

Methods and apparatus for embedding metallic wires within polymer structures through co-extrusion printing in large-format polymer additive manufacturing (LFPAM). The method includes receiving user input for object and wire regions, performing Boolean operations on the meshes, generating printing paths, and determining an optimized order for printing. The LFPAM tool, configured with a data processing apparatus, prints the object with embedded wire and anchors supporting the wire ends. The system may include the use of a cutting tool to separate the anchors from the printed object. This disclosure improves wire alignment, support, and printing performance, enhancing the properties of wire-embedded printed structures.

Find Patent Forward Citations

Loading…