The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2026

Filed:

May. 08, 2023
Applicant:

Edison Welding Institute, Inc., Columbus, OH (US);

Inventors:

Jacob C. Hay, Columbus, OH (US);

Ajay Krishnan, Columbus, OH (US);

Ron Aman, Columbus, OH (US);

Stanley L. Ream, Columbus, OH (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/02 (2014.01); B23K 26/03 (2006.01); B23K 26/082 (2014.01);
U.S. Cl.
CPC ...
B23K 26/082 (2015.10); B23K 26/032 (2013.01);
Abstract

System and methods for evaluating build platform flatness and parallelism relative to a focal plane of a high-speed laser in high-speed laser motion systems, wherein the high-speed laser motion systems include the high-speed laser that generates a laser beam, and the build platform having a work plane, comprising positioning a plurality of pin-hole sensors within the focal plane of the high-speed laser, wherein each of the pin-hole sensors is positioned at a predetermined location; directing the laser beam to the predetermined locations of each pin-hole sensor; measuring a spot size of the laser beam at each pin-hole sensor, wherein the spot size at each pin-hole defining structure has a measureable diameter; comparing the measurable diameters obtained at each pin-hole sensor; and adjusting the work plane of the build platform to a position where the measurable diameters of the spot sizes are equal at each pin-hole sensor.


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