The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2026
Filed:
Jan. 12, 2023
Stats Chippac Pte. Ltd, Singapore, SG;
Abstract
A method for making a semiconductor device is provided. The method includes: providing a package including: a substrate including a first surface and a second surface opposite to the first surface; a first electronic component mounted on the first surface of the substrate; a second electronic component mounted on the second surface; and a contact pad formed on the second surface of the substrate, wherein the contact pad is outside of a projection of the second electronic component on the second surface of the substrate; and a first encapsulant disposed on the first surface of the substrate and covering the first electronic component; forming a second encapsulant over and around the second electronic component, wherein the contact pad is exposed from the second encapsulant; planarizing the second encapsulant to expose the second electronic component; and forming a bump on the contact pad of the second surface of the substrate.