The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2026

Filed:

Jul. 01, 2022
Applicant:

Microchip Technology Incorporated, Chandler, AZ (US);

Inventor:

Yaojian Leng, Vancouver, WA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 1/00 (2025.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H10D 1/68 (2025.01);
U.S. Cl.
CPC ...
H10D 1/042 (2025.01); H01L 21/76802 (2013.01); H01L 23/5223 (2013.01); H01L 23/5226 (2013.01); H10D 1/716 (2025.01);
Abstract

A metal-insulator-metal (MIM) capacitor includes a bottom electrode, an insulator cup formed on the bottom electrode, a top electrode formed in an opening defined by the insulator cup, a top electrode connection element electrically connected to the top electrode, a vertically-extending bottom electrode contact electrically connected to the bottom electrode, and a bottom electrode connection element electrically connected to the vertically-extending bottom electrode contact. The bottom electrode is formed in a lower metal layer. The insulator cup is formed in a tub opening in a dielectric region and includes a laterally extending insulator cup base formed on the bottom electrode and a vertically-extending insulator cup sidewall extending upwardly from the laterally extending insulator cup base. The top electrode connection element and bottom electrode connection element are formed in an upper metal layer.


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