The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2026
Filed:
May. 17, 2023
Applicant:
Delta Electronics, Inc., Taoyuan City, TW;
Inventors:
Assignee:
Delta Electronics, Inc., Taoyuan City, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/36 (2006.01); B23K 1/00 (2006.01); H05K 1/14 (2006.01); H05K 3/341 (2026.01); H05K 3/3494 (2026.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/368 (2013.01); B23K 1/0016 (2013.01); H05K 1/144 (2013.01); H05K 3/341 (2013.01); H05K 3/3494 (2013.01); B23K 2101/42 (2018.08); H05K 2201/042 (2013.01); H05K 2201/10734 (2013.01); H05K 2201/10984 (2013.01); H05K 2203/043 (2013.01);
Abstract
An assembling method of an electronic module is disclosed and includes steps of: (a) providing a first circuit board including a first side and a second side; (b) providing a second circuit board including a third side and a fourth side, and a connection component connected to the third side; (c) providing a solder ball, and stacking the first circuit board, the second circuit board and the solder ball; and (d) performing a reflow soldering process to a stacked structure of the first circuit board, the second circuit board and the solder ball.