The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2026
Filed:
Jun. 07, 2023
Sumitomo Electric Industries, Ltd., Osaka, JP;
Sumitomo Electric Printed Circuits, Inc., Shiga, JP;
Yosuke Fukaya, Osaka, JP;
Koji Nitta, Osaka, JP;
Shoichiro Sakai, Osaka, JP;
Takuto Hidani, Osaka, JP;
Yoshihito Yamaguchi, Shiga, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., Shiga, JP;
Abstract
A printed circuit board includes a base film having a main surface, and an electrically conductive pattern disposed on the main surface. The electrically conductive pattern includes an electrically conductive base layer disposed on the main surface directly or indirectly, and a copper electroplating layer disposed on the electrically conductive base layer. The void density, being a value obtained by dividing a sum of areas of voids within a predetermined observation length at an interface between the electrically conductive base layer and the copper electroplating layer by the observation length, is more than 0.01 μm/μm and 5.5 μm/μm or less.