The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2026
Filed:
May. 25, 2023
Applicant:
The Boeing Company, Arlington, VA (US);
Inventors:
Kyle Avery Woolrich, El Segundo, CA (US);
Paul Christian Werntz, Long Beach, CA (US);
Assignee:
THE BOEING COMPANY, Arlington, VA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01P 5/107 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0209 (2013.01); H01P 5/107 (2013.01); H05K 1/0243 (2013.01); H05K 1/0272 (2013.01); H05K 1/115 (2013.01); H05K 2201/10098 (2013.01);
Abstract
A multi-embedded circuit board includes a first circuit board and a first cold plate thermally coupled to the first circuit board. The first circuit board includes a substrate and a power amplifier within the substrate, the power amplifier electrically coupled to one or more electromagnetic signal interfaces. The first cold plate includes one or more first cooling elements configured to extract heat from the power amplifier.
Woolrich, Kyle. (2026). Multi-embedded circuit board (U.S. Patent No. 12615709). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12615709
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile