The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2026

Filed:

Mar. 28, 2024
Applicant:

Xmems Taiwan Co., Ltd., Hsinchu County, TW;

Inventor:

Wei-Yang Li, Hsinchu County, TW;

Assignee:

XMEMS TAIWAN CO., LTD., Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/28 (2006.01); H04R 19/02 (2006.01); H04R 31/00 (2006.01);
U.S. Cl.
CPC ...
H04R 1/2803 (2013.01); H04R 19/02 (2013.01); H04R 31/00 (2013.01); H04R 2201/003 (2013.01);
Abstract

A covering structure disposed within a sound producing package includes a tube structure, a first chamber and a first connecting structure. The tube structure has a first sound opening and a second sound opening, wherein a tube cavity connected between the first sound opening and the second sound opening exists inside the tube structure. A first cavity exists inside the first chamber and is connected to the tube cavity of the tube structure. The first connecting structure is connected between the tube structure and the first chamber, wherein the first connecting structure is between the first sound opening and the second sound opening, and the first cavity of the first chamber is connected to the tube cavity of the tube structure through the first connecting structure. An acoustic pathway of the covering structure is formed between the first sound opening and the second sound opening.


Find Patent Forward Citations

Li, Wei-Yang. (2026). Covering structure, sound producing package and manufacturing method of sound producing package (U.S. Patent No. 12615474). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12615474

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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