The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2026

Filed:

Nov. 27, 2023
Applicant:

Hiwin Mikrosystem Corp., Taichung City, TW;

Inventors:

Mu-Kai Yu, Taichung City, TW;

Ruei-Bin Shiao, Taichung City, TW;

Cheng-Te Chi, Taichung City, TW;

Assignee:

HIWIN MIKROSYSTEM CORP., Taichung City, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02K 1/20 (2006.01); H02K 41/02 (2006.01);
U.S. Cl.
CPC ...
H02K 1/20 (2013.01); H02K 41/02 (2013.01); H02K 2213/03 (2013.01);
Abstract

In a linear motor cooling module provided by the invention, mainly at least one spoiler element is provided in a flow channel, the spoiler element has a first protrusion and a second protrusion that are staggered with each other, each of the protrusions extends toward a center of the flow channel in opposite directions, so that a cooling fluid flowing through the spoiler element is blocked by the first protrusion and the second protrusion respectively, thereby forming a turbulence to improve uneven temperature distribution and poor cooling effect.


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