The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2026
Filed:
Jan. 29, 2024
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Kun Hoi Koo, Suwon-si, KR;
Soung Jin Kim, Suwon-si, KR;
Young Soo Yi, Suwon-si, KR;
San Kyeong, Suwon-si, KR;
Yun Hee Kim, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
A multilayer electronic component includes: a body including a dielectric layer and first and second internal electrodes alternately disposed in a first direction with the dielectric layer interposed therebetween, a first external electrode and including a first alloy layer connected to the first internal electrode; and a second external electrode and including a second alloy layer connected to the second internal electrode, wherein the first and second alloy layers include alloys including Cu, Ni and Al, and a molar content of Ni included in the first alloy layer is greater than a molar content of Al, and a molar content of Cu is greater than the molar content of Ni.