The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2026
Filed:
Apr. 26, 2023
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Hye Jin Park, Suwon-si, KR;
Hong Je Choi, Suwon-si, KR;
Ji Hye Han, Suwon-si, KR;
Byung Woo Kang, Suwon-si, KR;
Su Yun Yun, Suwon-si, KR;
Sang Wook Lee, Suwon-si, KR;
Jung Min Kim, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
An example embodiment of the present disclosure provides a multilayer electronic component including an external electrode including an electrode layer and a conductive resin layer disposed on the electrode layer. The conductive resin layer includes conductive particles including at least one of Cu particles, CuSn and CuSn, and a resin, and in cross-sections of the conductive resin layer, a ratio of an area occupied by CuSn to the total area occupied by the Cu particles, CuSn, and CuSnis 1.88% to 38.89%, and a ratio of an area occupied by CuSnto the total area occupied by the Cu particles, CuSn and CuSnis 31.54% to 97.23%.