The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2026
Filed:
Mar. 18, 2022
Tdk Corporation, Tokyo, JP;
Michitaka Okazaki, Tokyo, JP;
Ikuya Kokubo, Tokyo, JP;
Takuya Takeuchi, Tokyo, JP;
Masaki Endo, Tokyo, JP;
Masaki Yoneyama, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
To suppress an increase in DC resistance due to surface roughening in a coil component including a spiral pattern. A coil component manufacturing method includes: a first step of forming a conductor layer including a spiral pattern spirally wound in a plurality of turns; a second step of selectively roughening an upper surface and an upper region of a peripheral-direction side surface of the spiral pattern; and a third step of forming an insulating resin layer so as to embed therein the conductor layer, and the first to third steps are repeatedly performed. Since the upper surface and the upper region of the side surface of the spiral pattern are selectively roughened, it is possible to suppress an increase in DC resistance due to excessive roughening at the lower region of the side surface.