The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2026
Filed:
Jan. 29, 2025
Applicant:
Rtx Corporation, Farmington, CT (US);
Inventors:
Cheng Gao, South Glastonbury, CT (US);
Howard J. Liles, Newington, CT (US);
Assignee:
RTX CORPORATION, Farmington, CT (US);
Primary Examiner:
Int. Cl.
CPC ...
F23R 3/00 (2006.01); F01D 11/08 (2006.01); F01D 25/12 (2006.01); F02C 7/12 (2006.01);
U.S. Cl.
CPC ...
F23R 3/007 (2013.01); F01D 11/08 (2013.01); F01D 25/12 (2013.01); F02C 7/12 (2013.01); F05D 2300/6033 (2013.01); F23R 3/002 (2013.01); F23R 2900/00018 (2013.01);
Abstract
The disclosure describes CMC components having structures which ameliorate stress induced by thermal expansion and methods for manufacturing CMC components with such structures. The CMC component, for example, a blade outer air seals (BOAS) is provided with a cooling cavity having a cavity top wall. The cavity top wall is provided with curvatures, such as corrugations or dimples, that allow the cavity top wall to expand and thereby reduce stress induced by thermal expansion.