The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2026
Filed:
Sep. 16, 2021
Kaneka Corporation, Osaka, JP;
Yoshiaki Matsuoka, Settsu, JP;
KANEKA CORPORATION, Osaka, JP;
Abstract
A resin composition for injection molding contains a poly(3-hydroxyalkanoate) resin. The poly(3-hydroxyalkanoate) resin includes at least one copolymer of 3-hydroxybutyrate units and other hydroxyalkanoate units. The average content of the 3-hydroxybutyrate units in the poly(3-hydroxyalkanoate) resin is from 92 to 99 mol %. The polystyrene-equivalent weight-average molecular weight of the poly(3-hydroxyalkanoate) resin, as measured by gel permeation chromatography using a chloroform solvent, is from 21×10to 38×10. In a weight molecular weight distribution of the poly(3-hydroxyalkanoate) resin, the proportion of a component having a weight molecular weight of 20×10or less is from 35 to 60 wt %.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile